Invention Grant
- Patent Title: System for modular tile installation
- Patent Title (中): 系统用于模块化瓦片安装
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Application No.: US13872576Application Date: 2013-04-29
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Publication No.: US09402496B2Publication Date: 2016-08-02
- Inventor: Graham A. H. Scott , David D. Oakey , John P. Bradford , Keith N. Gray
- Applicant: Interface, Inc.
- Applicant Address: US GA Atlanta
- Assignee: Interface, Inc.
- Current Assignee: Interface, Inc.
- Current Assignee Address: US GA Atlanta
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: E04F13/00
- IPC: E04F13/00 ; E04F15/00 ; E04F19/00 ; A47G27/04 ; A47G27/02 ; E04F15/02

Abstract:
Connectors for joining adjacent modular floor covering units. The connectors include a film and an adhesive layer coated on one side of the film. To install tiles using the connectors, a first tile is placed on the floor and a connector is positioned so that the adhesive layer faces upward and does not contact the floor. The connector is typically positioned so that only a portion of the adhesive layer adheres to the underside of the tile, leaving the remainder of the connector extending from the underside of the tile. Tiles are then positioned adjacent the first tile so that a portion of the connector adheres to the adjacent tiles. In this way, the connectors span adjacent tile edges. The tiles are assembled on a underlying flooring surface without the need to attach them to the floor surface. Rather, the tiles are linked to each other with the connectors, so that the tiles create a floor covering that “floats” on the underlying floor surface.
Public/Granted literature
- US20130232900A1 SYSTEM FOR MODULAR TILE INSTALLATION Public/Granted day:2013-09-12
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