发明授权
- 专利标题： Interposer having molded low CTE dielectric
- 专利标题（中）： 具有低CTE电介质的内插器
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申请号： US14221486申请日： 2014-03-21
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公开(公告)号： US09406532B2公开(公告)日： 2016-08-02
- 发明人: Belgacem Haba , Ilyas Mohammed
- 申请人： Tessera, Inc.
- 申请人地址： US CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/48 ; H01L23/498 ; H05K3/40
摘要：
A method for making an interconnection component is disclosed, including forming a plurality of metal posts extending away from a reference surface. Each post is formed having a pair of opposed end surface and an edge surface extending therebetween. A dielectric layer is formed contacting the edge surfaces and filling spaces between adjacent ones of the posts. The dielectric layer has first and second opposed surfaces adjacent the first and second end surfaces. The dielectric layer has a coefficient of thermal expansion of less than 8 ppm/° C. The interconnection component is completed such that it has no interconnects between the first and second end surfaces of the posts that extend in a lateral direction. First and second pluralities of wettable contacts are adjacent the first and second opposed surfaces. The wettable contacts are usable to bond the interconnection component to a microelectronic element or a circuit panel.
公开/授权文献
- US20140206184A1 INTERPOSER HAVING MOLDED LOW CTE DIELECTRIC 公开/授权日：2014-07-24
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