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    HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS
    7.
    发明申请
    HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS 审中-公开

    公开(公告)号：US20160315139A1

    公开(公告)日：2016-10-27

    申请号：US15198524

    申请日：2016-06-30

    申请人： Tessera, Inc.

    发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Piyush Savalia

    IPC分类号： H01L49/02 ,  H01L23/48

    CPC分类号： H01L28/91 ,  H01L23/481 ,  H01L28/40 ,  H01L28/60 ,  H01L2223/6622 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/00

    摘要： A component includes a substrate and a capacitor formed in contact with the substrate. The substrate can consist essentially of a material having a coefficient of thermal expansion of less than 10 ppm/° C. The substrate can have a surface and an opening extending downwardly therefrom. The capacitor can include at least first and second pairs of electrically conductive plates and first and second electrodes. The first and second pairs of plates can be connectable with respective first and second electric potentials. The first and second pairs of plates can extend along an inner surface of the opening, each of the plates being separated from at least one adjacent plate by a dielectric layer. The first and second electrodes can be exposed at the surface of the substrate and can be coupled to the respective first and second pairs of plates.

    Interposer having molded low CTE dielectric
    9.
    发明授权
    Interposer having molded low CTE dielectric 有权
    具有低CTE电介质的内插器

    公开(公告)号：US09406532B2

    公开(公告)日：2016-08-02

    申请号：US14221486

    申请日：2014-03-21

    申请人： Tessera, Inc.

    发明人： Belgacem Haba ,  Ilyas Mohammed

    IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L23/498 ,  H05K3/40

    CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L23/49861 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/15311 ,  H05K3/4046 ,  H05K2201/0979 ,  H05K2201/10378 ,  H05K2201/10674

    摘要： A method for making an interconnection component is disclosed, including forming a plurality of metal posts extending away from a reference surface. Each post is formed having a pair of opposed end surface and an edge surface extending therebetween. A dielectric layer is formed contacting the edge surfaces and filling spaces between adjacent ones of the posts. The dielectric layer has first and second opposed surfaces adjacent the first and second end surfaces. The dielectric layer has a coefficient of thermal expansion of less than 8 ppm/° C. The interconnection component is completed such that it has no interconnects between the first and second end surfaces of the posts that extend in a lateral direction. First and second pluralities of wettable contacts are adjacent the first and second opposed surfaces. The wettable contacts are usable to bond the interconnection component to a microelectronic element or a circuit panel.

    摘要翻译： 公开了一种用于制造互连部件的方法，包括形成远离参考表面延伸的多个金属柱。 每个柱形成具有一对相对的端面和在它们之间延伸的边缘表面。 形成接触边缘表面和相邻柱之间的填充空间的电介质层。 电介质层具有邻近第一和第二端面的第一和第二相对表面。 电介质层的热膨胀系数小于8ppm /℃。互连部件完成，使得它们在横向方向上延伸的柱的第一和第二端面之间没有互连。 第一和第二多个可湿接触部分邻近第一和第二相对表面。 可湿接触可用于将互连部件连接到微电子元件或电路板。