Invention Grant
US09406688B2 Vertical structure non-volatile memory device having insulating regions that are formed as air gaps
有权
具有形成为气隙的绝缘区域的垂直结构的非易失性存储器件
- Patent Title: Vertical structure non-volatile memory device having insulating regions that are formed as air gaps
- Patent Title (中): 具有形成为气隙的绝缘区域的垂直结构的非易失性存储器件
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Application No.: US14726065Application Date: 2015-05-29
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Publication No.: US09406688B2Publication Date: 2016-08-02
- Inventor: Sung-min Hwang , Han-soo Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sibley, P.A.
- Priority: KR10-2010-0074984 20100803
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L29/788 ; H01L29/792

Abstract:
A vertical structure non-volatile memory device includes semiconductor regions that vertically extend on a substrate, a plurality of memory cell strings that vertically extend on the substrate along sidewalls of the semiconductor regions and include a plurality of memory cells and at least one or more first selection transistors, which are disposed on sides of the memory cells and are adjacent to one another. A plurality of wordlines is connected to the memory cells of the memory cell strings. A first selection line is connected to the selection transistors of the memory cell strings and insulating regions are formed as air gaps between the first selection transistors of the adjacent memory cell strings.
Public/Granted literature
- US20150263021A1 VERTICAL STRUCTURE NON-VOLATILE MEMORY DEVICE HAVING INSULATING REGIONS THAT ARE FORMED AS AIR GAPS Public/Granted day:2015-09-17
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