Invention Grant
- Patent Title: Wafer releasing
- Patent Title (中): 晶圆释放
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Application No.: US14279137Application Date: 2014-05-15
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Publication No.: US09410249B2Publication Date: 2016-08-09
- Inventor: Mathias Male , Christian Maier , Philemon Schweizer , Manfred Bucher , Thomas Steiner
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/683
- IPC: H01L21/683 ; C23C16/458 ; H01L21/687 ; H02N13/00
Abstract:
Embodiments of the present invention provide a chuck system for handling a wafer that comprises a first and a second main surface. The chuck system includes a chuck configured to hold the wafer at the second main surface facing the chuck and a release device. The chuck system further includes an actuator configured to lift the release device away from the chuck. The release device is configured such that the release device mechanically engages with the wafer at an edge portion of the second main surface of the wafer when being lifted, thereby releasing the wafer from the chuck.
Public/Granted literature
- US20150332951A1 Wafer Releasing Public/Granted day:2015-11-19
Information query
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