Invention Grant
US09411025B2 Integrated circuit package having a split lead frame and a magnet
有权
集成电路封装，具有分离引线框架和磁体
- Patent Title: Integrated circuit package having a split lead frame and a magnet
- Patent Title (中): 集成电路封装，具有分离引线框架和磁体
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Application No.: US13871131Application Date: 2013-04-26
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Publication No.: US09411025B2Publication Date: 2016-08-09
- Inventor: Paul David , Ravi Vig , William P. Taylor , Andreas P. Friedrich
- Applicant: Allegro Microsystems, LLC
- Applicant Address: US MA Worcester
- Assignee: Allegro Microsystems, LLC
- Current Assignee: Allegro Microsystems, LLC
- Current Assignee Address: US MA Worcester
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Main IPC: G01R33/09
- IPC: G01R33/09 ; G01R33/00
Abstract:
A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads and a separately formed ferromagnetic element, such as a magnet, is disposed adjacent to the lead frame.
Public/Granted literature
- US20140320124A1 INTEGRATED CIRCUIT PACKAGE HAVING A SPLIT LEAD FRAME AND A MAGNET Public/Granted day:2014-10-30
Information query
