发明授权
- 专利标题： Packaged semiconductor sensor device with lid
- 专利标题（中）： 带盖的封装半导体传感器装置
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申请号： US14559921申请日： 2014-12-04
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公开(公告)号： US09416002B2公开(公告)日： 2016-08-16
- 发明人: Nan Xu , Xingshou Pang , Xuesong Xu
- 申请人： Nan Xu , Xingshou Pang , Xuesong Xu
- 申请人地址： US TX Austin
- 专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人： FREESCALE SEMICONDUCTOR, INC.
- 当前专利权人地址： US TX Austin
- 代理商 Charles E. Bergere
- 优先权： CN201410520628 20140728
- 主分类号： H01L29/84
- IPC分类号： H01L29/84 ; B81C1/00 ; B81B7/00
摘要：
A method for assembling a packaged semiconductor device includes mounting a pressure-sensing die onto a die paddle of a metal lead frame. A pressure-sensitive gel is dispensed into a recess of a lid, and the lead frame is mated with the lid such that the pressure-sensing die is immersed in the pressure-sensitive gel within the recess of the lid.
公开/授权文献
- US20160023894A1 PACKAGED SEMICONDUCTOR SENSOR DEVICE WITH LID 公开/授权日：2016-01-28
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