Invention Grant
US09418878B2 Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP
有权
半导体器件和形成粘合剂材料以将半导体裸片固定到WLCSP中的载体的方法
- Patent Title: Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP
- Patent Title (中): 半导体器件和形成粘合剂材料以将半导体裸片固定到WLCSP中的载体的方法
-
Application No.: US14340187Application Date: 2014-07-24
-
Publication No.: US09418878B2Publication Date: 2016-08-16
- Inventor: Reza A. Pagaila , Yaojian Lin
- Applicant: STATS ChipPAC, Ltd.
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee: STATS ChipPAC Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Patent Law Group: Atkins and Associates
- Agent Robert D. Atkins
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L23/48 ; H01L21/56 ; H01L21/683 ; H01L23/31 ; H01L23/538 ; H01L23/00 ; H01L21/68 ; H01L23/28

Abstract:
A semiconductor device is made by providing a temporary carrier and providing a semiconductor die having a plurality of bumps formed on its active surface. An adhesive material is deposited as a plurality of islands or bumps on the carrier or active surface of the semiconductor die. The adhesive layer can also be deposited as a continuous layer over the carrier or active surface of the die. The semiconductor die is mounted to the carrier. An encapsulant is deposited over the die and carrier. The adhesive material holds the semiconductor die in place to the carrier while depositing the encapsulant. An interconnect structure is formed over the active surface of the die. The interconnect structure is electrically connected to the bumps of the semiconductor die. The adhesive material can be removed prior to forming the interconnect structure, or the interconnect structure can be formed over the adhesive material.
Public/Granted literature
Information query
IPC分类: