发明授权
US09418950B2 Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers
有权
多频带多模收发器前端倒装芯片架构和具有集成功率放大器的电路
- 专利标题： Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers
- 专利标题（中）： 多频带多模收发器前端倒装芯片架构和具有集成功率放大器的电路
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申请号： US14260130申请日： 2014-04-23
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公开(公告)号： US09418950B2公开(公告)日： 2016-08-16
- 发明人: Lisette L. Zhang , Oleksandr Gorbachov
- 申请人： RFAXIS, INC
- 申请人地址： US ME Woburn
- 专利权人： SKYWORKS SOLUTIONS, INC.
- 当前专利权人： SKYWORKS SOLUTIONS, INC.
- 当前专利权人地址： US ME Woburn
- 代理机构： Stetina Brunda Garred & Brucker
- 主分类号： H04B1/40
- IPC分类号： H04B1/40 ; H01L23/00 ; H01L23/522 ; H01L23/66 ; H03F3/195 ; H04B1/00
摘要：
An integrated circuit architecture and circuitry is defined by a die structure with a plurality of exposed conductive pads arranged in a grid of rows and columns. The die structure has a first operating frequency region with a first transmit and receive chain, and a second operating frequency region with a second transmit chain and a second receive chain. There is a shared region of the die structure defined by an overlapping segment of the first operating frequency region and the second operating frequency region with a shared power supply input conductive pad connected to the first transmit chain, the second transmit chain, the first receive chain, and the second receive chain, and a shared power detection output conductive pad connected to the first transmit chain and the second transmit chain.
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