发明授权
- 专利标题: Conductive substrate comprising a metal fine particle sintered film
- 专利标题(中): 包含金属微粒烧结膜的导电性基材
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申请号: US13202425申请日: 2010-02-19
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公开(公告)号: US09420698B2公开(公告)日: 2016-08-16
- 发明人: Naonobu Yoshi , Mikiko Hojo
- 申请人: Naonobu Yoshi , Mikiko Hojo
- 申请人地址: JP Tokyo
- 专利权人: DAI NIPPON PRINTING CO., LTD.
- 当前专利权人: DAI NIPPON PRINTING CO., LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Ladas & Parry LLP
- 优先权: JP2009-038272 20090220
- 国际申请: PCT/JP2010/052563 WO 20100219
- 国际公布: WO2010/095723 WO 20100826
- 主分类号: H05K1/09
- IPC分类号: H05K1/09 ; H05K3/12 ; H05K1/03
摘要:
Provided is a conductive substrate which is prepared by forming a pattern-shaped metal fine particle sintered film such as a copper wiring and the like on a base material of polyimide and the like and which has a high adhesive property with the base material and is provided with an excellent conductivity.The conductive substrate of the present invention is prepared by printing a coating liquid containing metal or metal oxide fine particles on a base material to form a print layer and subjecting the above print layer to sintering treatment to form a metal fine particle sintered film, wherein a crystallite diameter in the metal fine particle sintered film which is measured by X ray diffraction is 25 nm or more, and a cross section of the metal fine particle sintered film has a void rate of 1% or less.
公开/授权文献
- US20120061130A1 CONDUCTIVE SUBSTRATE 公开/授权日:2012-03-15