Invention Grant
- Patent Title: Polishing apparatus
- Patent Title (中): 抛光设备
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Application No.: US14462736Application Date: 2014-08-19
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Publication No.: US09421662B2Publication Date: 2016-08-23
- Inventor: Sung-choul Lee , Choul-gue Park , Ki-hong Jung , Soo-young Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-Do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2013-0114143 20130925
- Main IPC: B24B21/00
- IPC: B24B21/00 ; B24B9/06 ; B24B37/02
Abstract:
A polishing apparatus including a chuck for supporting a wafer while exposing a peripheral portion of the wafer, a polishing head for polishing the peripheral portion of the wafer, and a polishing solution supplying assembly provided above the chuck and configured to spray a polishing solution on the wafer and to form a liquid curtain on the chuck to protect the wafer when the wafer is polished may be provided.
Public/Granted literature
- US20150087210A1 POLISHING APPARATUS Public/Granted day:2015-03-26
Information query
