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公开(公告)号：US12017292B2
公开(公告)日：2024-06-25
申请号：US17594105
申请日：2020-03-16
发明人： Yoshihito Noguchi , Ryo Takatsu , Isamu Ueda , Takeo Bandou , Nobuyuki Oka
摘要： A method for manufacturing a hypoid gear includes: a tooth cutting step of machining a shape of a tooth of the hypoid gear; a surface treatment step of forming a third intermediary gear provided with a hardened layer on a surface of the tooth; a lapping step of machining the third intermediary gear using an abrasive particle having a diameter of 14 μm or less to form a fourth intermediary gear; and a shot peening step of spraying a particle having a diameter of 160 μm or less onto the fourth intermediary gear.
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公开(公告)号：US10946492B2
公开(公告)日：2021-03-16
申请号：US15767479
申请日：2016-10-13
发明人： Hitomi Greenslet , Xueyu Du , Valens Nteziyaremye , Timothy Pham
IPC分类号： B24B29/08 , B24B31/112 , B24B37/025 , B24B41/06 , B24B1/00 , B24B35/00 , B24B37/27 , B24B37/02
摘要： Various examples are provided for polishing techniques for flexible tubular workpieces. In one example, a method includes supporting a tubular workpiece on a rod that extends axially through it; positioning a turning wheel against an external surface of the tubular workpiece, where it is held by magnetic attraction; and rotating the tubular workpiece by rotating the turning wheel. The external surface of the tubular workpiece is polished by the abrasive particles during rotation of the tubular workpiece. In another example, a polishing system includes a workpiece holder including a rod configured to axially support a tubular workpiece; a turning wheel with abrasive particles distributed about an outer surface; a wheel support assembly configured to position the outer surface of the turning wheel against the an external surface of the tubular workpiece, where it is held by magnetic attraction. The external surface is polished during rotation of the tubular workpiece.
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公开(公告)号：US20200206869A1
公开(公告)日：2020-07-02
申请号：US16237051
申请日：2018-12-31
发明人： Jonathan S. Hacker
IPC分类号： B24B53/017 , B24B53/07 , B24B53/12 , B24B37/02
摘要： A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.
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公开(公告)号：US10654146B2
公开(公告)日：2020-05-19
申请号：US15877615
申请日：2018-01-23
IPC分类号： B24B37/04 , B24B49/00 , B24B37/14 , B24B37/16 , B24B53/017 , B24B57/02 , B24B37/02 , B24B37/10
摘要： The present disclosure includes charging members for charging abrasive particles into the surface of a lapping plate. The charging members include one or more channels to permit abrasive slurry to flow through when the charging member is in contact with the lapping plate.
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公开(公告)号：US09789581B2
公开(公告)日：2017-10-17
申请号：US13876666
申请日：2011-10-18
申请人： Daniel R. Cloutier
发明人： Daniel R. Cloutier
CPC分类号： B24B37/11 , B24B33/02 , B24B33/08 , B24B33/083 , B24B33/085 , B24B37/02 , B24B57/02 , B24D9/02
摘要： A bore finishing tool has an arbor with a tapered outer circumferential surface and a sleeve over the arbor having a tapered inner circumferential surface cooperatively disposed in surface to surface overlaying relation to at least a substantial portion of the tapered outer circumferential surface of the arbor. The sleeve is adjustably movable relative to the arbor for expanding a diametrical extent of the sleeve and has a plurality of internal material relief features at circumferentially spaced locations in the tapered inner circumferential surface extending partially through the sleeve so as to reduce a level of force required for expanding the diametrical extent of the sleeve. Exemplary material relief features include flutes and fractures. The sleeve can also include an external retraction feature enabling application of a retraction force by an external device for reducing the diametrical extent.
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公开(公告)号：US09421662B2
公开(公告)日：2016-08-23
申请号：US14462736
申请日：2014-08-19
发明人： Sung-choul Lee , Choul-gue Park , Ki-hong Jung , Soo-young Kim
CPC分类号： B24B21/002 , B24B9/065 , B24B37/02
摘要： A polishing apparatus including a chuck for supporting a wafer while exposing a peripheral portion of the wafer, a polishing head for polishing the peripheral portion of the wafer, and a polishing solution supplying assembly provided above the chuck and configured to spray a polishing solution on the wafer and to form a liquid curtain on the chuck to protect the wafer when the wafer is polished may be provided.
摘要翻译： 一种抛光装置，包括用于在暴露晶片的周边部分的同时支撑晶片的卡盘，用于抛光晶片的周边部分的抛光头和设置在卡盘上方的抛光液供给组件， 并且可以提供在晶片被抛光时在卡盘上形成液体帘以保护晶片。
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公开(公告)号：US20130029565A1
公开(公告)日：2013-01-31
申请号：US13641410
申请日：2010-12-29
申请人： Royce Moore , Monte Smith , Richard Pae , Greg Turner
发明人： Royce Moore , Monte Smith , Richard Pae , Greg Turner
CPC分类号： B24B9/00 , B24B27/0007 , B24B27/0076 , B24B41/067 , B24D5/06
摘要： A machine system and method for simultaneously lapping a first machining surface of a hollow shaft and an opposing second machining surface of the hollow shaft, the machine system having a brake subsystem for securing the hollow shaft in a relatively stationary position while a drive subsystem rotates a lapping tool within the hollow shaft such that the lapping tool laps the first machining surface with an abrasive surface of a top lap while simultaneously lapping the second machining surface with an abrasive surface of a bottom lap.
摘要翻译： 一种用于同时研磨中空轴的第一加工表面和中空轴的相对的第二加工表面的机器系统和方法，所述机器系统具有制动子系统，用于将空心轴固定在相对静止的位置，同时驱动子系统旋转 研磨工具在空心轴内，使得研磨工具将第一加工表面与顶部搭接的研磨表面搭接，同时用第二加工表面研磨底圈的研磨表面。
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8.发明授权Process for the material-abrading machining of the edge of a semiconductor wafer 失效用于半导体晶片的边缘的材料研磨加工的工艺
公开(公告)号：US6045436A
公开(公告)日：2000-04-04
申请号：US906573
申请日：1997-08-05
CPC分类号： B24B27/0076 , B24B1/04 , B24B37/02 , B24B9/065
摘要： In a process for the material-abrading machining of the edge of a semiconductor wafer, the semiconductor wafer is resting on a rotationally movable table, is rotated about a central axis and is machined by a plurality of rotating machining tools. It is intended for each of the machining tools to abrade a specific quantity of material from the edge of the semiconductor wafer. The process is one in which the machining tools, during the course of a 360.degree.-rotation of the semiconductor wafer, are successively advanced toward the edge of the semiconductor wafer and ultimately simultaneously machine the edge of the semiconductor wafer. A machining tool which has just been advanced is intended to abrade a smaller quantity from the edge of the semiconductor wafer than a previously advanced machining tool. The machining of the edge of the semiconductor wafer with one machining tool is terminated at the earliest once the semiconductor wafer has rotated through 360.degree., calculated from the advancement of this machining tool.
摘要翻译： 在用于半导体晶片的边缘的材料研磨加工的过程中，半导体晶片搁置在可旋转移动的台上，围绕中心轴线旋转并且由多个旋转加工工具加工。 用于每个加工工具从半导体晶片的边缘研磨特定数量的材料。 该过程是在半导体晶片360度旋转的过程中，加工工具朝向半导体晶片的边缘连续地前进，最终同时加工半导体晶片的边缘。 刚刚推进的加工工具旨在比先前的先进的加工工具从半导体晶片的边缘磨蚀更少的加工工具。 一旦半导体晶片从该加工工具的推进计算出，一旦半导体晶片旋转了360度，半导体晶片边缘的加工就被最终终止。
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公开(公告)号：US5913717A
公开(公告)日：1999-06-22
申请号：US998552
申请日：1997-12-24
摘要： In a sphere polishing machine, workpiece balls in a ball passageways which are formed by guide grooves 5 formed in a stationary board 2 and guide grooves 1a formed in a rotary board 1 are moved along the ball passageways while being rotated by the rotary board 1, whereby the portion of the workpiece ball which is brought into contact with the guide groove 1a of the stationary board 1 in accordance with the inclination of the axis of rotation of the workpiece ball, is polished. On each of the ball passageways, a plurality of predetermined positions are selected at predetermined intervals, and relief grooves 6a, 6b and 6c are formed in guide groove portions of the stationary board which correspond the predetermined positions so that, when each of the workpiece balls passes through each of the predetermined positions, the inclination of the axis of rotation thereof is changed.
摘要翻译： 在球面抛光机中，通过形成在固定基板2上的引导槽5和形成在旋转板1上的引导槽1a形成的球通道中的工件滚珠沿着滚珠通道移动，同时由旋转板1旋转， 从而抛光与工件滚珠的旋转轴线的倾斜度相对应的与固定板1的引导槽1a接触的工件球的部分。 在每个球通道中，以预定间隔选择多个预定位置，并且在固定板的与预定位置相对应的引导槽部分中形成有释放槽6a，6b和6c，使得当每个工件球 通过每个预定位置，其旋转轴线的倾斜度改变。
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公开(公告)号：US5679055A
公开(公告)日：1997-10-21
申请号：US653666
申请日：1996-05-31
IPC分类号： H01L21/677 , B24B37/08 , B24B37/34 , B24B47/22 , B24B49/04 , H01L21/304 , B24B37/02
CPC分类号： B24B37/08 , B24B37/345 , B24B47/22 , B24B49/04
摘要： An automated wafer lapping system including a robot which loads wafers from a cassette into a wafer carrier on a lapping machine one at a time and one after another. The robot is capable of delivering lapped wafers to a thickness gauging device for measuring the wafer thickness and recalibrating the lapping machine between each run. Openings in the wafer carriers for receiving wafers are sized closely to the wafer for minimal relative motion between the wafer and carrier. A centering jig and search program for the robot facilitate fast location of the wafers in the openings. The lapping system also inspects wafers for defects and sorts them accordingly after lapping.
摘要翻译： 一种自动化晶片研磨系统，包括一个机器人，该机器人一次一个接一个地将晶片从盒子装载到研磨机上的晶片载体上。 机器人能够将重叠的晶片传送到厚度测量装置，用于测量晶片厚度，并在每次运行之间重新校准研磨机。 用于接收晶片的晶片载体中的开口尺寸与晶片的尺寸紧密相关，用于晶片和载体之间的最小相对运动。 用于机器人的定心夹具和搜索程序便于晶片在开口中的快速定位。 研磨系统还检查晶圆是否有缺陷，并在研磨后相应地进行分选。
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