Adhesive composition are described comprising the reaction product of at least one halogenated copolymer of isobutylene wherein halogen atoms of the copolymer are replaced by a polyamine having a melting point greater than 25° C., thereby crosslinking the copolymer. The isobutylene copolymer comprises halogenated repeat units derived from isoprene, butadiene, para-alkyl styrene, or a combination thereof. The adhesive composition comprises a copolymer of isobutylene repeat units and second repeat units selected from alkene repeat units, para-methyl styrene repeat units, or a combination thereof wherein at least a portion of the second repeat units are directly bonded to one another with a polyamine crosslinker having a melting point greater than 25° C. Also described are adhesive articles, such as tapes, comprising such adhesives.