Adhesive composition
    4.
    发明授权

    公开(公告)号:US11267996B2

    公开(公告)日:2022-03-08

    申请号:US15931323

    申请日:2020-05-13

    Applicant: LG CHEM, LTD.

    Abstract: Provided are an adhesive composition and an organic electronic device (OED) including the same, and more particularly, an adhesive composition, which may form an encapsulation structure effectively blocking moisture or oxygen flowing into an OED from the outside, thereby ensuring the lifespan of the OED, and facilitates coating in the process of forming the encapsulation structure of the OED, thereby preventing the problem of flow of bubbles into the encapsulation structure or blocking of a coating nozzle and thus enhancing processability, and an OED including the same.

    Non-Swelling Hot Melt Adhesive
    7.
    发明申请

    公开(公告)号:US20210238457A1

    公开(公告)日:2021-08-05

    申请号:US17049325

    申请日:2019-04-26

    Abstract: Provided herein is a hot melt pressure sensitive adhesive comprising one or more styrene block copolymers, a tackifier, and polyisobutylene plasticizer, wherein the adhesive contains less than 1 wt % of a plasticizer oil. The adhesive can be used in a label construction along with a facestock such as a polyethylene facestock, wherein the swelling factor of the facestock is reduced as compared to the swelling factor of the facestock in labels that include a plasticizer oil. Also provided are methods for producing and using the hot melt adhesive, and articles labeled with the hot melt adhesive.

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