发明授权
- 专利标题: Chip-inlaid flooring material using PLA resin
- 专利标题(中): 使用PLA树脂的镶嵌地板材料
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申请号: US13978498申请日: 2011-06-13
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公开(公告)号: US09422729B2公开(公告)日: 2016-08-23
- 发明人: Hyun-Jong Kwon , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee , Cheng-Zhe Huang
- 申请人: Hyun-Jong Kwon , Ji-Young Kim , Ki-Bong Park , Chang-Won Kang , Jun-Hyuk Kwon , Sang-Sun Park , Jang-Ki Kim , Gyeong-Min Lee , Cheng-Zhe Huang
- 申请人地址: KR Seoul
- 专利权人: LG HAUSYS, LTD.
- 当前专利权人: LG HAUSYS, LTD.
- 当前专利权人地址: KR Seoul
- 代理机构: Hauptman Ham, LLP
- 国际申请: PCT/KR2011/004316 WO 20110613
- 国际公布: WO2012/173287 WO 20121220
- 主分类号: B32B5/16
- IPC分类号: B32B5/16 ; E04F15/12 ; B32B27/36 ; B32B7/12 ; B32B27/12 ; B32B27/18 ; E04F15/10
摘要:
Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder.
公开/授权文献
- US20130302577A1 CHIP-INLAID FLOORING MATERIAL USING PLA RESIN 公开/授权日:2013-11-14