Invention Grant
- Patent Title: Reduced size semiconductor device and method for manufacture thereof
- Patent Title (中): 尺寸减小的半导体器件及其制造方法
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Application No.: US15015530Application Date: 2016-02-04
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Publication No.: US09424926B2Publication Date: 2016-08-23
- Inventor: Ya Jui Lee , Kuan Fu Chen
- Applicant: MACRONIX INTERNATIONAL CO., LTD
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Alston & Bird LLP
- Main IPC: G11C16/04
- IPC: G11C16/04 ; G11C16/06

Abstract:
A nonvolatile semiconductor device is provided that includes a substrate and a plurality of blocks forming a string. Each block is positioned on the substrate and includes a plurality of word lines disposed on the substrate. The string includes a single ground select line disposed at one side of the plurality of blocks, and a single string select line is disposed at another side of the plurality of blocks. In some embodiments, the word lines of the plurality of blocks define gaps separating each block of the string from neighboring blocks of the string. One or more dummy word lines may be disposed in each gap between blocks of the string. Corresponding methods of manufacturing the nonvolatile semiconductor device and manipulating the nonvolatile semiconductor device are provided.
Public/Granted literature
- US20160155508A1 Reduced Size Semiconductor Device And Method For Manufacture Thereof Public/Granted day:2016-06-02
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