Invention Grant
US09425156B2 Semiconductor packages having semiconductor chips disposed in opening in shielding core plate
有权
半导体封装具有设置在屏蔽芯板中的开口的半导体芯片
- Patent Title: Semiconductor packages having semiconductor chips disposed in opening in shielding core plate
- Patent Title (中): 半导体封装具有设置在屏蔽芯板中的开口的半导体芯片
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Application No.: US14283828Application Date: 2014-05-21
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Publication No.: US09425156B2Publication Date: 2016-08-23
- Inventor: Yoonha Jung , Jongkook Kim , Bona Baek , Heeseok Lee , Kyoungsei Choi
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2013-0089665 20130729
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L25/10 ; H01L23/498
Abstract:
A semiconductor package includes a first plate having a through hole therein, at least one interconnection layer disposed on a first surface of the first plate, and at least one semiconductor chip disposed on the at least one interconnection layer in a space defined by the through hole and electrically connected to the least one interconnection layer. The package further includes a second plate disposed on the at least one semiconductor chip and a second surface of the first plate on a side of the first plate opposite the first surface, and at least one conductive pad disposed on the second surface of the first plate and electrically connected to the at least one interconnection layer.
Public/Granted literature
- US20150028477A1 SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENING IN SHIELDING CORE PLATE Public/Granted day:2015-01-29
Information query
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