发明授权
- 专利标题: Inductive inertial sensor architecture and fabrication in packaging build-up layers
- 专利标题(中): 感应惯性传感器结构和制造在包装堆积层
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申请号: US13720876申请日: 2012-12-19
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公开(公告)号: US09429427B2公开(公告)日: 2016-08-30
- 发明人: Qing Ma , Feras Eid , Kevin Lin , Johanna M. Swan , Weng Hong Teh , Valluri R. Rao
- 申请人: Qing Ma , Feras Eid , Kevin Lin , Johanna M. Swan , Weng Hong Teh , Valluri R. Rao
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Blakely, Sokoloff, Taylor & Zafman LLP
- 主分类号: G01C19/00
- IPC分类号: G01C19/00 ; G01C19/56 ; G01C19/5776
摘要:
This invention relates to inductive inertial sensors employing a magnetic drive and/or sense architecture. In embodiments, translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. In embodiments, the vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity. In embodiments, self-inductances associated with a pair of meandering coils vary as a function of an angular velocity in a second dimension. In embodiments, package build-up layers are utilized to fabricate the inductive inertial sensors, enabling package-level integrated inertial sensing advantageous in small form factor computing platforms, such as mobile devices.
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