Invention Grant
- Patent Title: Method for polishing work and work polishing apparatus
- Patent Title (中): 抛光工件和抛光装置的方法
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Application No.: US14637546Application Date: 2015-03-04
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Publication No.: US09431262B2Publication Date: 2016-08-30
- Inventor: Kazutaka Shibuya , Yoshio Nakamura
- Applicant: FUJIKOSHI MACHINERY CORP.
- Applicant Address: JP Nagano
- Assignee: FUJIKOSHI MACHINERY CORP.
- Current Assignee: FUJIKOSHI MACHINERY CORP.
- Current Assignee Address: JP Nagano
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2014-051394 20140314
- Main IPC: H01L21/306
- IPC: H01L21/306 ; B24B37/04 ; B24B57/02 ; C23F1/08 ; C23F1/12 ; C23F1/14 ; H01L21/67 ; H01J37/32 ; H01L21/02 ; H01L29/16 ; H01L29/20
Abstract:
The method of the present invention is capable of polishing a high hardness work at high polishing efficiency. The method comprises the steps of: pressing a surface of the work onto a polishing part of a rotating polishing plate; and supplying slurry while performing the pressing step. The method is characterized in that an activated gas, which has been activated by gas discharge, is turned into bubbles and mixed into the slurry.
Public/Granted literature
- US20150262833A1 METHOD FOR POLISHING WORK AND WORK POLISHING APPARATUS Public/Granted day:2015-09-17
Information query
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