Provided is a printed circuit board (PCB). The PCB includes a board body that includes a first surface and a second surface opposite the first surface, a semiconductor chip mounting region that is disposed on the first surface of the board body, and includes a plurality of semiconductor chip mounting parts on which a semiconductor chip may be mounted, a through region that is disposed at a peripheral portion of the semiconductor chip mounting region, and includes a plurality of through holes passing through the board body, and an external terminal forming region that is disposed on the second surface of the board body, wherein a plurality of external terminal forming parts are disposed at the external terminal forming region in correspondence with the respective semiconductor chip mounting parts.