公开(公告)号：US09431272B2

公开(公告)日：2016-08-30

申请号：US14223240

申请日：2014-03-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chae-hun Im ,  Sang-uk Han

IPC: H05K7/10 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: Provided is a printed circuit board (PCB). The PCB includes a board body that includes a first surface and a second surface opposite the first surface, a semiconductor chip mounting region that is disposed on the first surface of the board body, and includes a plurality of semiconductor chip mounting parts on which a semiconductor chip may be mounted, a through region that is disposed at a peripheral portion of the semiconductor chip mounting region, and includes a plurality of through holes passing through the board body, and an external terminal forming region that is disposed on the second surface of the board body, wherein a plurality of external terminal forming parts are disposed at the external terminal forming region in correspondence with the respective semiconductor chip mounting parts.

Abstract translation: 提供了印刷电路板（PCB）。 PCB包括：板体，其包括第一表面和与第一表面相对的第二表面;半导体芯片安装区域，设置在板体的第一表面上，并且包括多个半导体芯片安装部件，半导体芯片安装部件上具有半导体 可以安装芯片，贯穿区域，其设置在半导体芯片安装区域的周边部分，并且包括穿过板体的多个通孔，以及设置在该半导体芯片安装区域的第二表面上的外部端子形成区域 板体，其中多个外部端子形成部件对应于各个半导体芯片安装部分设置在外部端子形成区域。