Invention Grant
- Patent Title: Semiconductor device having contact structures
- Patent Title (中): 具有接触结构的半导体器件
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Application No.: US14645954Application Date: 2015-03-12
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Publication No.: US09431324B2Publication Date: 2016-08-30
- Inventor: Seok-ho Shin
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel & Sibley, P.A.
- Priority: KR10-2014-0044424 20140414
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L23/48 ; H01L27/108

Abstract:
A semiconductor device includes: a substrate having a plurality of active regions; a plurality of bit lines extending in a first direction, the plurality of bit lines being separate from the substrate with an insulating layer therebetween; a plurality of first insulating lines extending in a second direction that is different from the first direction, wherein the plurality of first insulating lines intersect the plurality of bit lines and have upper surfaces having levels which are higher than those of upper surfaces of the plurality of bit lines relative to the substrate; and a plurality of first contact structures connected to the plurality of active regions, the plurality of first contact structures being disposed in an area defined by the plurality of bit lines and the plurality of first insulating lines.
Public/Granted literature
- US20150294923A1 SEMICONDUCTOR DEVICE Public/Granted day:2015-10-15
Information query
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