Invention Grant
- Patent Title: Slot die for film manufacturing
- Patent Title (中): 用于电影制作的插槽模具
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Application No.: US14571475Application Date: 2014-12-16
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Publication No.: US09434098B2Publication Date: 2016-09-06
- Inventor: Sung Won Choi , Jae Wook Nam , Byung Hee Sohn , Sun Jin Song , Chan Jae Ahn , Semi Lee , Sung Woo Hong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2014-0065326 20140529
- Main IPC: B29C47/14
- IPC: B29C47/14 ; B29C47/92 ; B29L7/00 ; B29C47/00

Abstract:
A slot die includes a material distribution chamber configured to distribute a casting solution supplied to the material distribution chamber, and a lip in which a slot including an expansion portion is defined and through which the casting solution distributed in the material distribution chamber is discharged, where a width of the expansion portion taken in a first direction is expanded from one side of the expansion portion to a lip end facing the one side and the one side of the expansion portion is apart from the lip end by a predetermined length taken along a second direction which is perpendicular to the first direction and substantially parallel to a flow direction of the casting solution.
Public/Granted literature
- US20150343689A1 SLOT DIE FOR FILM MANUFACTURING Public/Granted day:2015-12-03
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