Invention Grant
- Patent Title: Heat sink with an integrated vapor chamber
- Patent Title (中): 散热器与集成的蒸气室
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Application No.: US13778053Application Date: 2013-02-26
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Publication No.: US09436235B2Publication Date: 2016-09-06
- Inventor: Srinivasa Rao Damaraju , Joseph Walters , Dalton Seth O'Connor
- Applicant: NVIDIA Corporation
- Applicant Address: US CA Santa Clara
- Assignee: NVIDIA Corporation
- Current Assignee: NVIDIA Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Zilka-Kotab, PC
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; G06F1/20 ; H01L23/427
Abstract:
A cooling subsystem is provided for dissipating heat from processor. The cooling subsystem includes a heat sink comprising an upper portion having a plurality of fins formed therein and a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion.
Public/Granted literature
- US20140240918A1 HEAT SINK WITH AN INTEGRATED VAPOR CHAMBER Public/Granted day:2014-08-28
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