发明授权
- 专利标题： Wiring board, semiconductor device, and manufacturing methods thereof
- 专利标题（中）： 接线板，半导体器件及其制造方法
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申请号： US13161871申请日： 2011-06-16
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公开(公告)号： US09437454B2公开(公告)日： 2016-09-06
- 发明人: Motomu Kurata , Shinya Sasagawa , Fumika Taguchi , Yoshinori Ieda
- 申请人： Motomu Kurata , Shinya Sasagawa , Fumika Taguchi , Yoshinori Ieda
- 申请人地址： JP Atsugi-shi, Kanagawa-ken
- 专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人： Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址： JP Atsugi-shi, Kanagawa-ken
- 代理机构： Robinson Intellectual Property Law Office, P.C.
- 代理商 Eric J. Robinson
- 优先权： JP2010-148134 20100629
- 主分类号： H01L29/10
- IPC分类号： H01L29/10 ; H01L21/3213 ; H01L27/12
摘要：
It is an object to reduce defective conduction in a wiring board or a semiconductor device whose integration degree is increased. It is another object to manufacture a highly reliable wiring board or semiconductor device with high yield. In a wiring board or a semiconductor device having a multilayer wiring structure, a conductive layer having a curved surface is used in connection between conductive layers used for the wirings. The top of a conductive layer in a lower layer exposed by removal of an insulating layer therearound has a curved surface, so that coverage of the conductive layer in the lower layer with a conductive layer in an upper layer stacked thereover can be favorable. A conductive layer is etched using a resist mask having a curved surface, so that a conductive layer having a curved surface is formed.
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