- Patent Title: Substrate for semiconductor package and process for manufacturing
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Application No.: US14971165Application Date: 2015-12-16
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Publication No.: US09437532B2Publication Date: 2016-09-06
- Inventor: Tien-Szu Chen , Chun-Che Lee , Sheng-Ming Wang
- Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Klein, O'Neill & Singh, LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/48 ; H01L21/48 ; H01L21/768 ; H01L23/00 ; H05K3/40 ; H01L21/027 ; H01L23/31 ; H01L23/13
Abstract:
A semiconductor package substrate includes a core portion, an upper circuit layer and a plurality of pillars. The pillars are disposed on and project upward from the upper circuit layer. Top surfaces of the pillars are substantially coplanar. The pillars provide an electrical interconnect to a semiconductor die. Solder joint reliability as between the substrate and the semiconductor die is improved.
Public/Granted literature
- US20160104667A1 SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND PROCESS FOR MANUFACTURING Public/Granted day:2016-04-14
Information query
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