Invention Grant
- Patent Title: Electronic device
- Patent Title (中): 电子设备
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Application No.: US14283396Application Date: 2014-05-21
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Publication No.: US09437553B2Publication Date: 2016-09-06
- Inventor: Tohru Muramatsu , Takeshi Wakui , Toshiya Koyama , Masakazu Muranaga
- Applicant: FUJITSU COMPONENT LIMITED
- Applicant Address: JP Tokyo
- Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP2013-111241 20130527
- Main IPC: H01L23/552
- IPC: H01L23/552 ; H01L25/16
Abstract:
An electronic device includes a first substrate including a first electrode formed on a surface of the first substrate, an electronic component mounted on another surface of the first substrate, a second substrate placed on the first substrate via the electronic component, and a shield disposed between the first substrate and the second substrate.
Public/Granted literature
- US20140346653A1 ELECTRONIC DEVICE Public/Granted day:2014-11-27
Information query
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