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    Wireless module
    4.
    发明授权
    Wireless module 有权

    公开(公告)号：US10916827B2

    公开(公告)日：2021-02-09

    申请号：US16230330

    申请日：2018-12-21

    Applicant: FUJITSU COMPONENT LIMITED

    Inventor： Kimihiro Maruyama ,  Masakazu Muranaga ,  Masaru Sakurai ,  Tatsuya Kakehashi

    IPC: H01Q1/52 ,  H01Q1/12 ,  H01Q1/42 ,  H01Q21/06 ,  H01Q9/04

    Abstract: A wireless module including: a substrate that includes a first surface and a second surface on the back side of the first surface; a plurality of signal terminals that are provided on the first surface and the second surface, input and output signals; an antenna provided on the first surface; a signal processing circuit that is provided on the second surface, is connected between the signal terminals and the antenna, and performs various signal processings on signals input from the signal terminals and the antenna; wherein the signal terminals are arranged in horizontal symmetry on the first surface and the second surface, arranged at the same positions of the first surface and the second surface, and connected to a single signal line in the substrate.

    Module board
    6.
    发明授权
    Module board 有权
    模块板

    公开(公告)号：US09468104B2

    公开(公告)日：2016-10-11

    申请号：US14184958

    申请日：2014-02-20

    Applicant: FUJITSU COMPONENT LIMITED

    Inventor： Tatsuya Kakehashi ,  Masakazu Muranaga ,  Shinya Yamamoto

    IPC: H05K1/14 ,  H05K1/11 ,  H01L23/498

    CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/141 ,  H05K2201/10378 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A module board includes a first board including a first surface and a second surface, a second board where its first surface faces the second surface of the first board, an external electrode formed on the exterior of the second board, and a joining member joining the external electrode and a terminal provided on the second surface of the first board. The external electrode includes a first surface part positioned on the first surface of the second board, a second surface part positioned on a second surface of the second board opposite to the first surface, and a connecting part connecting the first and second surface parts. The joining member includes a joining surface joining to the external electrode. The joining surface covers the first surface part and at least a portion of the connecting part that is closer to the first surface part than to the second surface part.

    Abstract translation: 模块板包括：第一板，包括第一表面和第二表面;第二板，其第一表面面对第一板的第二表面，外部电极形成在第二板的外部;接合构件， 外部电极和设置在第一板的第二表面上的端子。 外部电极包括位于第二板的第一表面上的第一表面部分，位于与第一表面相对的第二板的第二表面上的第二表面部分和连接第一和第二表面部分的连接部分。 接合构件包括接合到外部电极的接合表面。 接合表面覆盖第一表面部分和连接部分的比第二表面部分更靠近第一表面部分的至少一部分。

    MODULE BOARD
    7.
    发明申请
    MODULE BOARD 有权
    模组

    公开(公告)号：US20140233191A1

    公开(公告)日：2014-08-21

    申请号：US14184958

    申请日：2014-02-20

    Applicant: FUJITSU COMPONENT LIMITED

    Inventor： Tatsuya Kakehashi ,  Masakazu Muranaga ,  Shinya Yamamoto

    IPC: H05K1/11 ,  H05K1/14

    CPC classification number: H05K1/144 ,  H01L23/49811 ,  H01L23/49833 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/141 ,  H05K2201/10378 ,  Y02P70/611 ,  H01L2924/00

    Abstract: A module board includes a first board including a first surface and a second surface, a second board where its first surface faces the second surface of the first board, an external electrode formed on the exterior of the second board, and a joining member joining the external electrode and a terminal provided on the second surface of the first board. The external electrode includes a first surface part positioned on the first surface of the second board, a second surface part positioned on a second surface of the second board opposite to the first surface, and a connecting part connecting the first and second surface parts. The joining member includes a joining surface joining to the external electrode. The joining surface covers the first surface part and at least a portion of the connecting part that is closer to the first surface part than to the second surface part.

    Abstract translation: 模块板包括：第一板，包括第一表面和第二表面;第二板，其第一表面面对第一板的第二表面，外部电极形成在第二板的外部;接合构件， 外部电极和设置在第一板的第二表面上的端子。 外部电极包括位于第二板的第一表面上的第一表面部分，位于与第一表面相对的第二板的第二表面上的第二表面部分和连接第一和第二表面部分的连接部分。 接合构件包括接合到外部电极的接合表面。 接合表面覆盖第一表面部分和连接部分的比第二表面部分更靠近第一表面部分的至少一部分。

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