Invention Grant
- Patent Title: Electrical cable assembly configured to be mounted onto an array of electrical contacts
- Patent Title (中): 电缆组件被配置成安装在电触点阵列上
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Application No.: US14498745Application Date: 2014-09-26
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Publication No.: US09437949B2Publication Date: 2016-09-06
- Inventor: Arash Behziz , Brian Patrick Costello , Michael David Herring
- Applicant: Tyco Electronics Corporation
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R13/648
- IPC: H01R13/648 ; H01R12/71 ; H01R13/6588 ; H01R13/6595 ; H01R12/59 ; H05K1/14

Abstract:
Cable assembly including a carrier board having a terminating side and a mounting side that face in opposite directions. The terminating side includes a contact array of electrical contacts. The mounting side includes a mating array of electrical contacts. The contact array and the mating array are interconnected to each other through conductive pathways of the carrier board. The contact array along the terminating side overlaps with the mating array along the mounting side. The carrier board is configured to be mounted onto an electrical component having a two-dimensional array. The cable assembly also includes a plurality of cables having cable end portions that are coupled to the carrier board. The cable assembly includes a shield assembly that extends over the terminating side and covers the cable end portions and the contact array.
Public/Granted literature
- US20160093966A1 ELECTRICAL CABLE ASSEMBLY CONFIGURED TO BE MOUNTED ONTO AN ARRAY OF ELECTRICAL CONTACTS Public/Granted day:2016-03-31
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