Invention Grant
- Patent Title: Semiconductor to metal transition
- Patent Title (中): 半导体到金属过渡
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Application No.: US14940797Application Date: 2015-11-13
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Publication No.: US09443971B2Publication Date: 2016-09-13
- Inventor: Andreas Haertl , Frank Hille , Francisco Javier Santos Rodriguez , Daniel Schloegl , Andre Rainer Stegner , Christoph Weiss
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: DE102014223315 20141114
- Main IPC: H01L29/00
- IPC: H01L29/00 ; H01L21/22 ; H01L21/38 ; H01L29/78 ; H01L29/739 ; H01L29/66 ; H01L29/10 ; H01L29/06

Abstract:
A semiconductor device includes a diffusion barrier layer, a first semiconductor region having first charge carriers of a first conductivity type and a second semiconductor region having second charge carriers. The first semiconductor region includes a transition region in contact with the second semiconductor region, the transition region having a first concentration of the first charge carriers, a contact region in contact with the diffusion barrier layer, the contact region having a second concentration of the first charge carriers, wherein the second concentration is higher than the first concentration, and a damage region between the contact region and the transition region. The damage region is configured for reducing the lifetime and/or the mobility of the first charge carriers of the damage region as compared to the lifetime and/or the mobility of the first charge carriers of the contact region and the transition region.
Public/Granted literature
- US20160141406A1 Semiconductor to Metal Transition Public/Granted day:2016-05-19
Information query
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