A multiple-in-one receptacle connector used for an audio equipment includes an insulating housing, receptacle connectors, and sealants. The insulating housing has a top surface having cavities disposed thereon and a bottom surface. Each cavity has a bottom having through holes disposed thereon and penetrating through the bottom surface. Each receptacle connector accommodated in the corresponding cavity includes terminals. Each terminal has a soldering section extending backward out of the corresponding receptacle connector. The soldering sections of each receptacle connector pass through the through holes disposed on the bottom of the corresponding cavity, respectively, to be out of the bottom surface. Each sealant disposed on the bottom surface seals gaps formed between the soldering sections of each receptacle connector and the through holes disposed on the bottom of the corresponding cavity. Sounds are prevented from leaking from gaps by the sealants sealing the gaps.