Invention Grant
- Patent Title: TTI-bundling and SPS operation in LTE TDD
- Patent Title (中): LTE TDD中的TTI绑定和SPS操作
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Application No.: US14507641Application Date: 2014-10-06
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Publication No.: US09444586B2Publication Date: 2016-09-13
- Inventor: Madhavan Srinivasan Vajapeyam , Wanshi Chen , Hao Xu , Xiaoxia Zhang , Peter Gaal
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Arent Fox LLP
- Main IPC: H04L1/16
- IPC: H04L1/16 ; H04L1/18 ; H04L5/00 ; H04L5/14

Abstract:
A method, an apparatus, and a computer program product for wireless communication are provided. The apparatus receives a semi-persistent scheduling (SPS) message indicating transmission of a first packet during a first period of a first hybrid automatic repeat request (HARQ) process, and a configuration for TTI-bundled transmission. The apparatus transmits a first TTI-bundled packet on the first resources during the first period of the first HARQ process. The apparatus identifies second resources for transmitting a second TTI-bundled packet during a second period of the first HARQ process based on the SPS message. The apparatus determines whether to offset transmission of the second TTI-bundled packet to a period of a second HARQ process when at least one of the second resources for transmitting the second TTI-bundled packet overlaps with at least one resource used for retransmitting the first TTI-bundled packet according to the first HARQ process.
Public/Granted literature
- US20150098371A1 TTI-BUNDLING AND SPS OPERATION IN LTE TDD Public/Granted day:2015-04-09
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