Invention Grant
- Patent Title: Electronic device including removable component
- Patent Title (中): 电子设备包括可移动组件
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Application No.: US14464955Application Date: 2014-08-21
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Publication No.: US09444919B2Publication Date: 2016-09-13
- Inventor: Seung-Jae Bae , Jae-Il Seo , Hong-Moon Chun
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC.
- Priority: KR10-2013-0104846 20130902
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H04M1/02
Abstract:
An electronic device is provided, including a mounting plate, a first component and a second component disposed on the mounting plate, a substrate disposed on the mounting plate and having a portion disposed between the first component and the second component, and a third component disposed on the mounting plate and electrically coupled to the substrate.
Public/Granted literature
- US20150062844A1 ELECTRONIC DEVICE INCLUDING REMOVABLE COMPONENT Public/Granted day:2015-03-05
Information query
