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公开(公告)号:US10462917B2
公开(公告)日:2019-10-29
申请号:US16232686
申请日:2018-12-26
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yong-Seok Lee , Tae-Hwan Kang , Hyun-Jun Kwon , Ki-Deuk Kim , Sang-Hyeon Kim , Jin-A Mock , Sung-Young Lee , Min-Su Jung , Hong-Moon Chun , Jung Woong Hyun
Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
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公开(公告)号:US09615467B2
公开(公告)日:2017-04-04
申请号:US13875063
申请日:2013-05-01
Applicant: Samsung Electronics Co., Ltd
Inventor: Hee-Cheul Moon , Jae-Il Seo , Hong-Moon Chun
CPC classification number: H05K5/0017 , F21V33/0052 , H04M1/0277 , H04M1/22 , H04M1/23 , H04M2250/22
Abstract: A mounting structure for circuit boards in an electronic device is provided. The mounting structure includes a housing, a first circuit board, a second circuit board, and an electrical connector. The housing houses parts. The first circuit board is fixed to the housing. The second circuit board is overlapped in at least a portion with the first circuit board and is fixed to the housing. The electrical connector is configured to electronically connect the first circuit board and the second circuit board.
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公开(公告)号:US10003679B2
公开(公告)日:2018-06-19
申请号:US15639508
申请日:2017-06-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yong-Seok Lee , Jin-A Mock , Soon-Woong Yang , Seung-Hoon Lee , Min-Su Jung , Hong-Moon Chun , Kun-Chan Seo
IPC: H04M1/00 , H04M1/02 , H04B1/3888 , H04M1/18 , G06F1/16
CPC classification number: H04M1/0202 , G06F1/1656 , H04B1/3888 , H04M1/185
Abstract: A mobile phone is provided, which includes a metal bezel having a left bezel portion and a right bezel portion and covering at least one part of an outer circumferential edge of a main body of the mobile phone, wherein upper and lower corner bezel portions of the left and right bezel portion are formed to be thicker outwardly in comparison with a middle portion of the left and right bezel portions.
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公开(公告)号:US09625949B2
公开(公告)日:2017-04-18
申请号:US14796514
申请日:2015-07-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yong-Seok Lee , Tae-Hwan Kang , Hyun-Jun Kwon , Ki-Deuk Kim , Sang-Hyeon Kim , Jin-A Mock , Sung-Young Lee , Min-Su Jung , Hong-Moon Chun , Jung-Woong Hyun
CPC classification number: H05K5/0217 , G06F1/1637 , G06F1/1658 , H04M1/0202 , H04M1/0277 , H04M1/185 , H05K5/0017 , H05K5/0247 , H05K7/1427
Abstract: An electronic device is provided. The electronic device includes a support member including at least a portion formed of a conductive material, an enclosure member configured to receive the support member and including at least a portion of which is formed of a conductive material. The conductive material portion of the enclosure member and the conductive material portion of the support member are insulated from each other.
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公开(公告)号:US20130294047A1
公开(公告)日:2013-11-07
申请号:US13875063
申请日:2013-05-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hee-Cheul Moon , Jae-IL Seo , Hong-Moon Chun
CPC classification number: H05K5/0017 , F21V33/0052 , H04M1/0277 , H04M1/22 , H04M1/23 , H04M2250/22
Abstract: A mounting structure for circuit boards in an electronic device is provided. The mounting structure includes a housing, a first circuit board, a second circuit board, and an electrical connector. The housing houses parts. The first circuit board is fixed to the housing. The second circuit board is overlapped in at least a portion with the first circuit board and is fixed to the housing. The electrical connector is configured to electronically connect the first circuit board and the second circuit board.
Abstract translation: 提供了一种用于电子设备中的电路板的安装结构。 安装结构包括壳体,第一电路板,第二电路板和电连接器。 住房部分。 第一个电路板固定在外壳上。 第二电路板至少与第一电路板重叠并且固定到壳体。 电连接器被配置为电连接第一电路板和第二电路板。
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公开(公告)号:US09699279B2
公开(公告)日:2017-07-04
申请号:US14802381
申请日:2015-07-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yong-Seok Lee , Jin-A Mock , Soon-Woong Yang , Seung-Hoon Lee , Min-Su Jung , Hong-Moon Chun , Kun-Chan Seo
IPC: H04M1/00 , H04M1/02 , G06F1/16 , H04M1/18 , H04B1/3888
CPC classification number: H04M1/0202 , G06F1/1656 , H04B1/3888 , H04M1/185
Abstract: A mobile phone is provided, which includes a metal bezel having a left bezel portion and a right bezel portion and covering at least one part of an outer circumferential edge of a main body of the mobile phone, wherein upper and lower corner bezel portions of the left and right bezel portion are formed to be thicker outwardly in comparison with a middle portion of the left and right bezel portions.
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公开(公告)号:US09622364B2
公开(公告)日:2017-04-11
申请号:US14624735
申请日:2015-02-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang-In Baek , Kwang-Jin Bae , Soon-Woong Yang , Hong-Moon Chun
CPC classification number: H05K5/0286 , G06F1/1613 , G06F1/1658 , H05K5/0221 , H05K5/0226
Abstract: An electronic device is provided which may include a tray, an exterior cover, and/or a first hooking structure. The tray may be inserted or drawn to or from an inside via an opening of a housing of the electronic device, and may include a space for receiving a card. The exterior cover may be movably coupled to the tray. The first hooking structure may be disposed inside the electronic device, and may maintain a closed state of the exterior cover, and may release the closed state of the exterior cover in response to pressing of the exterior cover.
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公开(公告)号:US09478777B2
公开(公告)日:2016-10-25
申请号:US14837409
申请日:2015-08-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jong-Min Choi , Hong-Moon Chun
IPC: H01M2/10 , G06F1/16 , H04B1/3883 , H04M1/02 , H04B1/3888
CPC classification number: H01M2/1066 , G06F1/1635 , H01M2220/30 , H04B1/3883 , H04B1/3888 , H04M1/0262
Abstract: An electronic device may include a battery pack and a battery pack mount portion. The battery pack may be mounted or secured within the battery pack mount portion in such a way that the battery pack does not influence or apply pressure to neighboring structures. For examples, the battery pack may include at least one eat protrusion that is received within at least one recess formed in the battery pack mount portion.
Abstract translation: 电子设备可以包括电池组和电池组安装部分。 电池组可以以这样的方式安装或固定在电池组安装部分中,使得电池组不会影响或施加相邻结构的压力。 例如,电池组可以包括容纳在形成在电池组安装部分中的至少一个凹部内的至少一个吃入突起。
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公开(公告)号:US09285843B2
公开(公告)日:2016-03-15
申请号:US14146620
申请日:2014-01-02
Applicant: Samsung Electronics Co., Ltd
Inventor: Jong-Min Choi , Soon-Woong Yang , Hong-Moon Chun
CPC classification number: G06F1/188 , G06F1/1635 , H01M2/1022 , H01M2/1066 , H04M1/0262
Abstract: An electronic device includes a housing defining an exterior of the electronic device, the housing accommodating a main board, a metal plate coupled to the housing, and a battery attached to the metal plate, the battery being electrically connected to the main board.
Abstract translation: 电子设备包括限定电子设备的外部的壳体,容纳主板的壳体,联接到壳体的金属板以及附接到金属板的电池,电池电连接到主板。
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公开(公告)号:US09450218B2
公开(公告)日:2016-09-20
申请号:US14197663
申请日:2014-03-05
Applicant: Samsung Electronics Co., Ltd.
Inventor: Jong-Min Choi , Hong-Moon Chun
IPC: H01M2/10 , G06F1/16 , H04B1/3883 , H04M1/02 , H04B1/3888
CPC classification number: H01M2/1066 , G06F1/1635 , H01M2220/30 , H04B1/3883 , H04B1/3888 , H04M1/0262
Abstract: An electronic device may include a battery pack and a battery pack mount portion. The battery pack may be mounted or secured within the battery pack mount portion in such a way that the battery pack does not influence or apply pressure to neighboring structures. For examples, the battery pack may include at least one eat protrusion that is received within at least one recess formed in the battery pack mount portion.
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