Methods and apparatuses for cutting thin film solar cells are provided. According to various implementations, the methods involve cutting a substrate having thin film solar cell materials deposited thereon by inducing a tear along the cutting line. Simultaneously with the tearing, the torn edges may be plastically deformed to produce a desired torn edge cross-sectional profile. Such a fracture may be induced by clamping regions of the substrate while simultaneously displacing the clamped regions relative to each other through the thickness of the substrate as the substrate is fed through the clamps providing the clamping. Apparatuses for cutting are also provided. According to various implementations, the apparatus may have cutter rollers and support rollers configured with an adjustable radial overlap.