A method of fabricating a MEMS device provides a device substrate, forms a plurality of trenches in/on the substrate, and forms a sacrificial material on the substrate (e.g., growing or depositing the sacrificial material) to form a plurality of etch channels. Each trench defines one etch channel, and each etch channel forms an interior configured to channel etchant. The method also bonds a handle substrate to the sacrificial material of the device substrate, and removes at least a portion of the sacrificial material.