Invention Grant
- Patent Title: Touch panel structure and fabrication method for the same
-
Application No.: US14136790Application Date: 2013-12-20
-
Publication No.: US09448672B2Publication Date: 2016-09-20
- Inventor: Sheng-Feng Chung , Cheng-Yi Shih , Shu-Yi Chang , Su-Tsai Lu
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: G06F3/044
- IPC: G06F3/044

Abstract:
A touch panel structure includes a transparent substrate having a touch area and a frame wire area, X conductive electrodes, Y conductive electrodes, X conductive connecting sections connecting the X conductive electrodes along a first direction, frame wires, insulated layers and Y conductive connecting bridges on the insulated layers. The X and Y conductive electrodes are respectively arranged in an array in the touch area and interlaced with each other. The X and Y conductive electrodes are electrically connected to an external circuit via the frame wires. The insulated layers each cover one of the X conductive electrodes and two of the Y conductive electrodes. The Y conductive electrodes are electrically connected to each other via the Y conductive connecting bridges along a second direction. A conducting material is performed by one-time printing to pattern the X and Y conductive electrodes, X conductive connecting sections and frame wires.
Public/Granted literature
- US20150177867A1 Touch panel structure and fabrication method for the same Public/Granted day:2015-06-25
Information query