A cooling system for molded modules includes a plurality of individual modules each including a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and at least partly uncovered by the mold compound, and a cooling plate at least partly uncovered by the mold compound. A molded body surrounds a periphery of each individual module to form a multi-die module. The leads of each individual module and the cooling plates are at least partly uncovered by the molded body. A lid with a port is attached to a periphery of the molded body at a first side of the multi-die module. The lid seals the multi-die module at the first side to form a cavity between the lid and the molded body for permitting fluid exiting or entering the port to contact the cooling plates of each individual module.