A printed circuit board mounted with a power module having both a plurality of lead terminals for soldering and at least one screw terminal for screwing includes a through hole which receives the lead terminal and is soldered to the lead terminal, and an electrode section provided with a screw hole fastened to the screw terminal via a screw. A groove is formed between the electrode section and the through hole so as to intersect with two common tangents each connecting, to an outer periphery of a land of the through hole, an outer periphery of a contact area of the electrode section which is in contact with a head bearing surface of a screw or a washer.