Invention Grant
US09455143B2 Atomic layer epitaxy for semiconductor gate stack layer for advanced channel devices
有权
用于高级通道器件的半导体栅极叠层的原子层外延
- Patent Title: Atomic layer epitaxy for semiconductor gate stack layer for advanced channel devices
- Patent Title (中): 用于高级通道器件的半导体栅极叠层的原子层外延
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Application No.: US14789075Application Date: 2015-07-01
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Publication No.: US09455143B2Publication Date: 2016-09-27
- Inventor: Swaminathan T. Srinivasan , Aaron Muir Hunter , Matthias Bauer , Amikam Sade
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/67 ; H01L21/268 ; H01L21/687

Abstract:
Embodiments of the present disclosure provide methods and apparatus for forming an epitaxial layer on a substrate. The substrate is exposed to pulsed laser radiation to clean, anneal, and/or activate the surface of the substrate. The substrate is then exposed to a deposition precursor in a self-limiting deposition process. The substrate may again be exposed to pulsed laser radiation, and then exposed to a second deposition precursor in a second self-limiting deposition process. The process may be repeated as desired to form an epitaxial layer of very high quality one atomic layer at a time.
Public/Granted literature
- US20160013046A1 ATOMIC LAYER EPITAXY FOR SEMICONDUCTOR GATE STACK LAYER FOR ADVANCED CHANNEL DEVICES Public/Granted day:2016-01-14
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