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US09455143B2 Atomic layer epitaxy for semiconductor gate stack layer for advanced channel devices 有权
用于高级通道器件的半导体栅极叠层的原子层外延

Atomic layer epitaxy for semiconductor gate stack layer for advanced channel devices
Abstract:
Embodiments of the present disclosure provide methods and apparatus for forming an epitaxial layer on a substrate. The substrate is exposed to pulsed laser radiation to clean, anneal, and/or activate the surface of the substrate. The substrate is then exposed to a deposition precursor in a self-limiting deposition process. The substrate may again be exposed to pulsed laser radiation, and then exposed to a second deposition precursor in a second self-limiting deposition process. The process may be repeated as desired to form an epitaxial layer of very high quality one atomic layer at a time.
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