Invention Grant
- Patent Title: Low cost interposer and method of fabrication
- Patent Title (中): 低成本插入器和制造方法
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Application No.: US13830279Application Date: 2013-03-14
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Publication No.: US09455162B2Publication Date: 2016-09-27
- Inventor: Cyprian Emeka Uzoh
- Applicant: Invensas Corporation
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/64 ; H01L23/498 ; H01L21/48
Abstract:
A method for making an interposer is provided. A conductive layer is formed by contacting a replicate such that a shape of a surface of the conductive layer conforms to a shape of the contacted portion of the replicate. The conductive layer is formed to have a base and a plurality of conductive posts projecting away from the base. Each conductive post is formed to have a post end opposite the base. A dielectric layer is formed to cover the base and to separate adjacent ones of the posts from each other. The posts are for forming vias. Conductive material is removed from the conductive layer to insulate at least one post from at least one other post.
Public/Granted literature
- US09418879B2 Low cost interposer and method of fabrication Public/Granted day:2016-08-16
Information query
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