A dynamic logic circuit in which the number of elements is reduced, the layout area is reduced, the power loss is reduced, and the power consumption is reduced is provided. A semiconductor device including a dynamic logic circuit includes a first transistor in which a channel is formed in silicon and a second transistor in which a channel is formed in an oxide semiconductor. Here, a structure in which the second transistor is provided over the first transistor can be employed. A structure in which an insulating film is provided over the first transistor, and the second transistor is provided over the insulating film can be employed. A structure in which a top surface of the insulating film is planarized can be employed. A structure in which the second transistor has a region overlapping with the first transistor can be employed.