Invention Grant
- Patent Title: Conductor structure element and method for producing a conductor structure element
- Patent Title (中): 导体结构元件及其制造方法
-
Application No.: US13515012Application Date: 2010-12-17
-
Publication No.: US09456500B2Publication Date: 2016-09-27
- Inventor: Thomas Gottwald , Alexander Neumann
- Applicant: Thomas Gottwald , Alexander Neumann
- Applicant Address: DE Schramberg
- Assignee: SCHWEIZER ELECTRONIC AG
- Current Assignee: SCHWEIZER ELECTRONIC AG
- Current Assignee Address: DE Schramberg
- Agency: Shlesinger, Arkwright & Garvey LLP
- Priority: DE102009060480 20091218
- International Application: PCT/EP2010/007736 WO 20101217
- International Announcement: WO2011/079918 WO 20110707
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K1/18 ; H01L21/48 ; H01L21/56 ; H01L21/683 ; H01L23/31 ; H01L23/538 ; H01L23/00 ; H05K3/20 ; H05K3/42 ; H05K3/46
Abstract:
The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed.
Public/Granted literature
- US20120320549A1 Conductor Structural Element and Method for Producing a Conductor Structural Element Public/Granted day:2012-12-20
Information query
