A heat management structure for a wearable electronic device includes a first thermally conductive layer, a second thermally conductive layer, and insulating layer. The first and second thermally conductive layers and the insulating layer are arranged in a stacked configuration along their surface areas with the insulating layer disposed between and in physical contact with the first and second thermally conductive layers. At least one edge of the second thermally conductive layer extends beyond an edge of at least one of the first thermally conductive layer or the insulating layer.