Invention Grant
- Patent Title: Inbred corn line IL3
- Patent Title (中): 近交玉米线IL3
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Application No.: US14205918Application Date: 2014-03-12
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Publication No.: US09456568B2Publication Date: 2016-10-04
- Inventor: Antoon Van Der Reijden
- Applicant: LIMAGRAIN EUROPE S.A. , KSW SAAT AG
- Applicant Address: FR Saint-Beauzire DE Einbeck
- Assignee: Limagrain Europe S.A.,KWS SAAT AG
- Current Assignee: Limagrain Europe S.A.,KWS SAAT AG
- Current Assignee Address: FR Saint-Beauzire DE Einbeck
- Agency: Cooley LLP
- Main IPC: A01H5/10
- IPC: A01H5/10 ; A23L1/10

Abstract:
Inbred corn line, designated IL3, is disclosed. The invention relates to the seeds of inbred corn line IL3, to the plants and plant parts of inbred corn line IL3, and to methods for producing a corn plant, either inbred or hybrid, by crossing inbred corn line IL3 with itself or another corn line. The invention also relates to products produced from the seeds, plants, or parts thereof, of inbred corn line IL3 and/or of the hybrids produced using the inbred as a parent. The invention further relates to methods for producing a corn plant containing in its genetic material one or more transgenes and to the transgenic plants produced by that method and to methods for producing other inbred corn lines derived from inbred corn line IL3.
Public/Granted literature
- US20140283182A1 INBRED CORN LINES IL3, CB26, CB27, II13, ML22, MM46, AND MM69 Public/Granted day:2014-09-18
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