发明授权
- 专利标题： Polishing apparatus and polishing method
- 专利标题（中）： 抛光设备和抛光方法
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申请号： US13073218申请日： 2011-03-28
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公开(公告)号： US09457447B2公开(公告)日： 2016-10-04
- 发明人: Masaya Seki , Tetsuji Togawa , Masayuki Nakanishi
- 申请人： Masaya Seki , Tetsuji Togawa , Masayuki Nakanishi
- 申请人地址： JP Tokyo
- 专利权人： EBARA CORPORATION
- 当前专利权人： EBARA CORPORATION
- 当前专利权人地址： JP Tokyo
- 代理机构： Wenderoth, Lind & Ponack, L.L.P.
- 主分类号： B24B1/00
- IPC分类号： B24B1/00 ; B24B21/00 ; B24B9/06 ; B24B21/20 ; H01L21/306 ; H01L21/67 ; H01L21/68 ; H01L21/84 ; H01L21/66
摘要：
The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.
公开/授权文献
- US20120252320A1 POLISHING APPARATUS AND POLISHING METHOD 公开/授权日：2012-10-04
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