Invention Grant
US09459315B2 Tray for aligning semiconductor packages and test handler using the same, and method of aligning semiconductor packages and test method using the same
有权
用于对准半导体封装的托盘和使用其的测试处理器，以及使用该半导体封装的测试方法和使用其的测试方法
- Patent Title: Tray for aligning semiconductor packages and test handler using the same, and method of aligning semiconductor packages and test method using the same
- Patent Title (中): 用于对准半导体封装的托盘和使用其的测试处理器，以及使用该半导体封装的测试方法和使用其的测试方法
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Application No.: US14217911Application Date: 2014-03-18
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Publication No.: US09459315B2Publication Date: 2016-10-04
- Inventor: Jong Won Han , Sang Il Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2013-0028588 20130318
- Main IPC: G01R31/28
- IPC: G01R31/28 ; H01L21/673 ; H01L21/68
Abstract:
A tray for aligning semiconductor packages, a test handler using the same, a method of aligning the semiconductor packages, and a test method using the same include a tray main body comprising a plurality of package pocket portions at which a plurality of semiconductor packages are individually received and an air position-aligning unit coupled to the tray main body. The air position-aligning unit applies air having a preset pressure to the semiconductor package received at the package pocket portion. The semiconductor package is aligned at the package pocket portion.
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