发明授权
- 专利标题: Enhanced stacked microelectronic assemblies with central contacts
- 专利标题(中): 具有中心触点的增强堆叠微电子组件
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申请号: US14270885申请日: 2014-05-06
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公开(公告)号: US09461015B2公开(公告)日: 2016-10-04
- 发明人: Belgacem Haba , Wael Zohni , Richard Dewitt Crisp
- 申请人: Tessera, Inc.
- 申请人地址: US CA San Jose
- 专利权人: Tessera, Inc.
- 当前专利权人: Tessera, Inc.
- 当前专利权人地址: US CA San Jose
- 代理机构: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- 优先权: KR10-2010-0129890 20101217
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H01L25/065 ; H01L23/13 ; H01L23/498 ; H01L25/10 ; H01L23/31 ; H01L23/00 ; H01L27/146
摘要:
A microelectronic assembly includes a dielectric element having first and second surfaces, first and second apertures extending between the first and second surfaces and defining a central region of the first surface between the first and second apertures, first and second microelectronic elements, and leads extending from contacts exposed at respective front surfaces of the first and second microelectronic elements to central terminals exposed at the central region. The front surface of the first microelectronic element can face the second surface of the dielectric element. The front surface of the second microelectronic element can face a rear surface of the first microelectronic element. The contacts of the second microelectronic element can project beyond an edge of the first microelectronic element. At least first and second ones of the leads can electrically interconnect a first central terminal of the central terminals with each of the first and second microelectronic elements.