Invention Grant
- Patent Title: Method for penetrating a flexible circuit board
- Patent Title (中): 穿透柔性电路板的方法
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Application No.: US14090157Application Date: 2013-11-26
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Publication No.: US09462685B2Publication Date: 2016-10-04
- Inventor: Gwun-Jin Lin , Kuo-Fu Su , Chih-Heng Chuo
- Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.
- Applicant Address: TW Taoyuan County
- Assignee: Advanced Flexible Circuits Co., Ltd.
- Current Assignee: Advanced Flexible Circuits Co., Ltd.
- Current Assignee Address: TW Taoyuan County
- Agency: Rosenberg, Klein & Lee
- Priority: TW102125021A 20130712
- Main IPC: H05K1/02
- IPC: H05K1/02 ; B29C53/04

Abstract:
Disclosed are a method and a structure of penetration and combination for a flexible circuit board with a hinge assembly. A pre-formed flexible circuit board is processed by taking a pre-folding line as a center line to fold a connection section of the flexible circuit board toward the terminal distribution section. Then, the connection section is rolled in a direction toward the terminal distribution section so as to make the connection section forming a rolled body. The rolled body is then put through the bore of the hinge assembly to have the rolled body completely extend through the bore of the hinge assembly so that the extension section of the flexible circuit board is positioned in the bore of the hinge assembly and the first end and the second end are respectively located at opposite sides of the bore of the hinge assembly.
Public/Granted literature
- US20150017818A1 METHOD AND STRUCTURE OF PENETRATION AND COMBINATION FOR FLEXIBLE CIRCUIT BOARD WITH HINGE ASSEMBLY Public/Granted day:2015-01-15
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