Invention Grant
- Patent Title: Circuit module and method for producing such a circuit module
- Patent Title (中): 电路模块及其制造方法
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Application No.: US13514549Application Date: 2010-12-07
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Publication No.: US09462696B2Publication Date: 2016-10-04
- Inventor: Stephan Mazingue-Desailly , Michael Mueller
- Applicant: Stephan Mazingue-Desailly , Michael Mueller
- Applicant Address: DE Stuttgart
- Assignee: Robert Bosch GmbH
- Current Assignee: Robert Bosch GmbH
- Current Assignee Address: DE Stuttgart
- Agency: Michael Best & Friedrich LLP
- Priority: DE102009047681 20091208
- International Application: PCT/EP2010/069072 WO 20101207
- International Announcement: WO2011/070015 WO 20110616
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/30 ; H05K3/28 ; B60R16/023 ; H05K5/06

Abstract:
The invention relates to a circuit module (10) having a circuit carrier (12), at least one circuit (14) mounted on the circuit carrier (12), encapsulated by a protective material (16), and at least one electrical/electronic component (18) encapsulated by a protective coating (20), protecting the at least one electrical/electronic component (18) from the protective material (16), and to a method for producing the circuit module (10). According to the invention, the protective coating (20) protecting the at least one electrical/electronic component (18) is only partially encapsulated by the protective material (16).
Public/Granted literature
- US20130208433A1 CIRCUIT MODULE AND METHOD FOR PRODUCING SUCH A CIRCUIT MODULE Public/Granted day:2013-08-15
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